Temperature management in wearable devices

ABSTRACT

Systems and methods for managing temperatures of wearable device components are disclosed. In one aspects, a method includes determining a temperature of an electronic component of the wearable device, determining a rate of temperature change of the electronic component, and determining whether to increase or decrease a transmission rate limit of the electronic component based on the temperature and the rate, adjusting the transmission rate limit based on the determination, and limiting a rate of transmission of the electronic component based on the adjusted transmission rate limit.

CLAIM OF PRIORITY

This application is a continuation of U.S. patent application Ser. No.17/304,567, filed Jun. 23, 2021, which is a continuation of U.S. patentapplication Ser. No. 16/723,663, filed Dec. 20, 2019, which is acontinuation of U.S. patent application Ser. No. 16/236,114, filed Dec.28, 2018, which is a continuation of U.S. patent application Ser. No.15/693,103, filed Aug. 31, 2017, each of which are incorporated hereinby reference in their entireties.

BACKGROUND

The design of many wearable display systems may be constrained to ensureconform with certain requirements such as form factor. This constraintmay result in marginal designs for electronic components. Theconstrained design may limit the functionality of these components whencompared to designs without the constraints. This is particularly truefor glasses with an integrated camera or display and wearable devicesthat integrate multiple functions using additional sensor or circuitryfor other functions. Therefore, improved methods of managing theseelectronic components under these design constraints are desired.

BRIEF DESCRIPTION OF THE DRAWINGS

Various ones of the appended drawings merely illustrate exampleembodiments of the present disclosure and should not be considered aslimiting its scope.

FIG. 1 is a front perspective view of one embodiment of a camera device.

FIG. 2 is a block diagram illustrating a networked system includingdetails of a camera device, according to some example embodiments.

FIGS. 3 and 4 illustrate wearable devices including transmissioncomponents according to certain example embodiments.

FIG. 5 is a flow diagram illustrating aspects of temperature managementin exemplary wearable devices.

FIG. 6 is a graph showing a relationship between ambient temperature andacceptable wearable device temperature.

FIG. 7 illustrates a wearable device including transmission components,an ambient temperature sensor, and a wearable temperature sensor inaccordance with certain example embodiments.

FIG. 8 is a flowchart for an exemplary method of temperature managementof a wearable device.

FIG. 9 is a block diagram illustrating an example of a softwarearchitecture that may be installed on a machine, according to someexample embodiments.

FIG. 10 illustrates a diagrammatic representation of a machine in theform of a computer system within which a set of instructions may beexecuted for causing the machine to perform any one or more of themethodologies discussed herein, according to an example embodiment.

DETAILED DESCRIPTION

The description that follows includes systems, methods, techniques,instruction sequences, and computing machine program products thatembody illustrative embodiments of the disclosure. In the followingdescription, for the purposes of explanation, numerous specific detailsare set forth in order to provide an understanding of variousembodiments of the inventive subject matter. It will be evident,however, to those skilled in the art, that embodiments of the inventivesubject matter may be practiced without these specific details. Ingeneral, well-known instruction instances, protocols, structures, andtechniques are not necessarily shown in detail.

Embodiments described herein relate to systems and methods for managingtemperature in a wearable device. Temperature of wearable devices may bemanaged by the disclosed methods and systems by limiting transmissionbandwidth in some aspects based on a current temperature of anelectronic component and in some aspects also based on a rate oftemperature change of the electronic component. In some aspects, thetemperature management may be based on at least two differenttemperature zones. When a temperature of an electronic component iswithin a first temperature zone, a first rate of change threshold maycontrol how bandwidth is limited. When the temperature of the electroniccomponent is within a second temperature zone, a second rate of changethreshold may control how bandwidth is limited.

The disclosed methods and systems may provide for a more consistent userexperience with WiFi transfers, while also preventing shutdown ofelectronic components due to those components reaching temperatureconstraints. The disclosed methods and systems may provide for improvedcomfort of the wearable device by ensuring that the touch temperature ofthe wearable device does not move into a temperature range that isuncomfortable for the user.

Certain embodiments described in detail herein include eyeglasses withintegrated camera and wireless communication functionality. One exampleembodiment of such glasses includes a video processor for processingpicture and video data from a camera. This camera data can then eitherbe stored locally, or sent wirelessly to a client device such as asmartphone. Such glasses include separate low-power circuitry andhigh-speed circuitry in addition to the video processor. The low-powercircuitry is designed to allow a low-power state, where the videoprocessor and high-speed circuitry are off, and the low-power circuitryis monitoring battery power levels and communications with the user'ssmartphone or other client devices. Power levels and basic devicefunctionality can be monitored from an application of a smartphone incommunication with the glasses. The low-power circuitry is designed tobe able to maintain this low-power state of the glasses for weeks on asingle battery charge. Low-power state communications using thelow-power circuitry may be enabled using a low-power wireless protocolsuch as Bluetooth™ low energy (Bluetooth LE.) By using a low-powerprocessor and low-power wireless circuitry, the glasses are able toconserve power while maintaining a limited “on” state that avoidscertain delays associated with powering on from an “off” state. Thislow-power “on” state also allows a user's smartphone to connect to theglasses at any time when the glasses have a battery charge.

The glasses of this example embodiment include a single button thatallows a user to capture pictures or video. When the button is pressedand released, a picture is taken. When the button is pressed and held, avideo is captured for the duration of the button hold. In either case,the low-power processor receives an input signal from the button, andthe low-power processor manages the capture of camera data. Thelow-power processor may boot the video processor, and the videoprocessor then captures camera data and writes the camera data tomemory. The video processor may then be automatically powered off, andthe glasses may return to a low-power state. In order to enable captureof camera data that is responsive to a user's button press whileconserving power, the video processor of this example implementationuses a read only memory (ROM) with direct memory access (DMA) to bootthe video processor in some aspects. Such a video processor can bootfrom an off state to capturing camera data within 300 milliseconds, andcan then be returned to the off state as soon as the camera data iswritten to memory. This creates a responsive user experience whilelimiting battery drain.

Similarly, once camera data is captured in this example embodiment, thelow-power circuitry manages an energy efficient connection to a clientdevice, and transfer of the camera data to the device. For example, ifthe camera data is captured when there is no client device nearby, thelow-power wireless circuitry may periodically transmit a service setidentifier (SSID.) When a smartphone running an application associatedwith the glasses receives the SSID, the application may automaticallyrequest any new camera data from the glasses. The low-power processorverifies that the camera data has not been sent to the smartphonepreviously; then the low-power processor boots a high-speed processor ofthe high-speed circuitry. The high-speed processor turns on high-speedwireless circuitry, such as an 802.11 Wi-Fi chip. This high-speedwireless circuitry is then used to transmit the camera data from thememory of the glasses to the smartphone. When the transmission of cameradata completes, the high-speed circuitry may be automatically powereddown, and the glasses return to the low-power state. Just as with thecapture of camera data above, the low-power processor manages thehigh-speed circuitry, which consumes more power, to limit the powerconsumption by automatically returning the glasses to the low-powerstate when the data transfer is complete.

If the button on the glasses is pressed during transmission of thecamera data, the low-power processor may interrupt the transmission toallow the video processor to boot, capture additional camera data, andpower down as described above. The transfer may then be resumed if thesmartphone is still in communication with the glasses, or may be resumedlater if the connection has been interrupted.

The above example embodiment of glasses with an integrated camera is notlimiting, and it will be apparent that many different embodiments arepossible in view of the descriptions herein. Certain embodiments may beglasses with only the elements described above, including lenses, aframe, a video processor, high-speed circuitry, low-speed circuitry, asingle button, and a battery system, with no other components. Otherembodiments may have additional sensors, user interfaces, expandedmemory, or any combination of additional elements.

One particular additional embodiment may include a display integratedwith glasses. Such an embodiment may operate to conserve power in amanner similar to the operations described above for camera operationand camera data transfer. For example, an example embodiment with adisplay may operate in a low-power mode, with display elements powereddown and low-power circuitry monitoring battery-life and low-powerconnections with client devices. Such an embodiment may receive acommunication via a low-power wireless connection to display mediacontent on the display of the glasses. In response to the communication,the low-power circuitry will initiate a power up and boot of anyspecified elements, present the media content on the display of thedevice, and then automatically power down the display and associatedcircuitry to return to the low-power state after a fixed amount of time.Such operations may be integrated with any other operations andinterrupts for any other elements included in the glasses with thedisplay system.

Additionally, certain embodiments may not be glasses, but may behandheld camera devices, clothing attachments, watches, or any othersuch wearable device configured to capture camera data and communicatethe data wirelessly to a client device. Additional details of exampleembodiments are described below.

FIG. 1 shows aspects of certain embodiments illustrated by a frontperspective view of glasses 31. The glasses 31 can include a frame 32made from any suitable material such as plastic or metal, including anysuitable shape memory alloy. The frame 32 can have a front piece 33 thatcan include a first or left lens, display or optical element holder 36and a second or right lens, display or optical element holder 37connected by a bridge 38. The front piece 33 additionally includes aleft end portion 41 and a right end portion 42. A first or left opticalelement 43 and a second or right optical element 44 can be providedwithin respective left and right optical element holders 36, 37. Each ofthe optical elements 43, 44 can be a lens, a display, a display assemblyor a combination of the foregoing. Any of the display assembliesdisclosed herein can be provided in the glasses 31.

Frame 32 additionally includes a left arm or temple piece 46 and asecond arm or temple piece 47 coupled to the respective left and rightend portions 41, 42 of the front piece 33 by any suitable means such asa hinge (not shown), so as to be coupled to the front piece 33, orrigidly or fixably secured to the front piece so as to be integral withthe front piece 33. Each of the temple pieces 46 and 47 can include afirst portion 51 that is coupled to the respective end portion 41 or 42of the front piece 33 and any suitable second portion 52 for coupling tothe ear of the user. In one embodiment the front piece 33 can be formedfrom a single piece of material, so as to have a unitary or integralconstruction. In one embodiment, such as illustrated in FIG. 1 , theentire frame 32 can be formed from a single piece of material so as tohave a unitary or integral construction.

Glasses 31 can include a computing device, such as computer 61, whichcan be of any suitable type so as to be carried by the frame 32 and, inone embodiment of a suitable size and shape, so as to be at leastpartially disposed in one of the temple pieces 46 and 47. In oneembodiment, as illustrated in FIG. 1 , the computer 61 is sized andshaped similar to the size and shape of one of the temple pieces 46, 47and is thus disposed almost entirely if not entirely within thestructure and confines of such temple pieces 46 and 47. In oneembodiment, the computer 61 can be disposed in both of the temple pieces46, 47. The computer 61 can include one or more processors with memory,wireless communication circuitry, and a power source. As describedabove, the computer 61 comprises low-power circuitry, high-speedcircuitry, and a display processor. Various other embodiments mayinclude these elements in different configurations or integratedtogether in different ways. Additional details of aspects of computer 61may be implemented as illustrated by camera device 210 discussed below.

The computer 61 additionally includes a battery 62 or other suitableportable power supply. In one embodiment, the battery 62 is disposed inone of the temple pieces 46 or 47. In the glasses 31 shown in FIG. 1 thebattery 62 is shown as being disposed in left temple piece 46 andelectrically coupled using connection 74 to the remainder of thecomputer 61 disposed in the right temple piece 47. The one or more inputand output devices can include a connector or port (not shown) suitablefor charging a battery 62 accessible from the outside of frame 32, awireless receiver, transmitter or transceiver (not shown) or acombination of such devices. In various embodiments, the computer 61 andthe battery 62 may consume power as part of glasses operations forcapturing images, transmitting data, or performing other computingprocesses. Such power consumption may result in heat that may impact thedevice as well as a user wearing the device. Embodiments describedherein may function to manage temperature in wearable devices such asglasses 31.

Glasses 31 include cameras 69. Although two cameras are depicted, otherembodiments contemplate the use of a single or additional (i.e., morethan two) cameras. In various embodiments, glasses 31 may include anynumber of input sensors or peripheral devices in addition to cameras 69.Front piece 33 is provided with an outward facing, forward-facing orfront or outer surface 66 that faces forward or away from the user whenthe glasses 31 are mounted on the face of the user, and an oppositeinward-facing, rearward-facing or rear or inner surface 67 that facesthe face of the user when the glasses 31 are mounted on the face of theuser. Such sensors can include inwardly-facing video sensors or digitalimaging modules such as cameras that can be mounted on or providedwithin the inner surface 67 of the front piece 33 or elsewhere on theframe 32 so as to be facing the user, and outwardly-facing video sensorsor digital imaging modules such as cameras 69 that can be mounted on orprovided with the outer surface 66 of the front piece 33 or elsewhere onthe frame 32 so as to be facing away from the user. Such sensors,peripheral devices or peripherals can additionally include biometricsensors, location sensors, or any other such sensors.

FIG. 2 is a block diagram illustrating a networked system 200 includingdetails of a camera device 210, according to some example embodiments.In certain embodiments, camera device 210 may be implemented in glasses31 of FIG. 1 described above.

System 200 includes camera device 210, client device 290, and serversystem 298. Client device 290 may be a smartphone, tablet, phablet,laptop computer, access point, or any other such device capable ofconnecting with camera device 210 using both a low-power wirelessconnection 225 and a high-speed wireless connection 237. Client device290 is connected to server system 298 and network 295. The network 295may include any combination of wired and wireless connections. Serversystem 298 may be one or more computing devices as part of a service ornetwork computing system. Client device 290 and any elements of serversystem 298 and network 295 may be implemented using details of softwarearchitecture 902 or machine 1000 described in FIGS. 9 and 10 .

System 200 may optionally include additional peripheral device elements219 and/or a display 211 integrated with camera device 210. Suchperipheral device elements 219 may include biometric sensors, additionalsensors, or display elements integrated with camera device 210. Examplesof peripheral device elements 219 are discussed further with respect toFIGS. 9 and 10 . For example, peripheral device elements 219 may includeany I/O components 1050 including output components, 1052 motioncomponents 1058, or any other such elements described herein. Exampleembodiments of a display 211 are discussed in FIGS. 3 and 4 .

Camera device 210 includes camera 214, video processor 212, interface216, low-power circuitry 220, and high-speed circuitry 230. Camera 214includes digital camera elements such as a charge coupled device, alens, or any other light capturing elements that may be used to capturedata as part of camera 214. In some aspects, the camera 214 may be thecamera 69, discussed above with respect to FIG. 1 .

Interface 216 refers to any source of a user command that is provided tocamera device 210. In one implementation, interface 216 is a physicalbutton on a camera that, when depressed, sends a user input signal frominterface 216 to low power processor 222. A depression of such a camerabutton followed by an immediate release may be processed by low powerprocessor 222 as a request to capture a single image. A depression ofsuch a camera button for a first period of time may be processed bylow-power processor 222 as a request to capture video data while thebutton is depressed, and to cease video capture when the button isreleased, with the video captured while the button was depressed storedas a single video file. In certain embodiments, the low-power processor222 may have a threshold time period between the press of a button and arelease, such as 500 milliseconds or one second, below which the buttonpress and release is processed as an image request, and above which thebutton press and release is interpreted as a video request. The lowpower processor 222 may make this determination while the videoprocessor 212 is booting. In other embodiments, the interface 216 may beany mechanical switch or physical interface capable of accepting userinputs associated with a request for data from the camera 214. In otherembodiments, the interface 216 may have a software component, or may beassociated with a command received wirelessly from another source.

Video processor 212 includes circuitry to receive signals from thecamera 214 and process those signals from the camera 214 into a formatsuitable for storage in the memory 234. Video processor 212 isstructured within camera device 210 such that it may be powered on andbooted under the control of low-power circuitry 220. Video processor 212may additionally be powered down by low-power circuitry 220. Dependingon various power design elements associated with video processor 212,video processor 212 may still consume a small amount of power even whenit is in an off state. This power will, however, be negligible comparedto the power used by video processor 212 when it is in an on state, andwill also have a negligible impact on battery life. As described herein,device elements in an “off” state are still configured within a devicesuch that low-power processor 222 is able to power on and power down thedevices. A device that is referred to as “off” or “powered down” duringoperation of camera device 210 does not necessarily consume zero powerdue to leakage or other aspects of a system design.

In one example embodiment, video processor 212 comprises amicroprocessor integrated circuit (IC) customized for processing sensordata from camera 214, along with volatile memory used by themicroprocessor to operate. In order to reduce the amount of time thatvideo processor 212 takes when powering on to processing data, anon-volatile read only memory (ROM) may be integrated on the IC withinstructions for operating or booting the video processor 212. This ROMmay be minimized to match a minimum size needed to provide basicfunctionality for gathering sensor data from camera 214, such that noextra functionality that would cause delays in boot time are present.The ROM may be configured with direct memory access (DMA) to thevolatile memory of the microprocessor of video processor 212. DMA allowsmemory-to-memory transfer of data from the ROM to system memory of thevideo processor 212 independently of operation of a main controller ofvideo processor 212. Providing DMA to this boot ROM further reduces theamount of time from power on of the video processor 212 until sensordata from the camera 214 can be processed and stored. In certainembodiments, minimal processing of the camera signal from the camera 214is performed by the video processor 212, and additional processing maybe performed by applications operating on the client device 290 orserver system 298.

Low-power circuitry 220 includes low-power processor 222 and low-powerwireless circuitry 224. These elements of low-power circuitry 220 may beimplemented as separate elements or may be implemented on a single IC aspart of a system on a single chip. Low-power processor 222 includeslogic for managing the other elements of the camera device 210. Asdescribed above, for example, low power processor 222 may accept userinput signals from an interface 216. Low-power processor 222 may also beconfigured to receive input signals or instruction communications fromclient device 290 via low-power wireless connection 225. Additionaldetails related to such instructions are described further below.Low-power wireless circuitry 224 includes circuit elements forimplementing a low-power wireless communication system. Bluetooth™Smart, also known as Bluetooth™ low energy, is one standardimplementation of a low power wireless communication system that may beused to implement low-power wireless circuitry 224. In otherembodiments, other low power communication systems may be used.

High-speed circuitry 230 includes high-speed processor 232, memory 234,and high-speed wireless circuitry 236. High-speed processor 232 may beany processor capable of managing high-speed communications andoperation of any general computing system needed for camera device 210.High speed processor 232 includes processing resources needed formanaging high-speed data transfers on high-speed wireless connection 237using high-speed wireless circuitry 236. In certain embodiments, thehigh-speed processor 232 executes an operating system such as a LINUXoperating system or other such operating system such as operating system904 of FIG. 9 . In addition to any other responsibilities, thehigh-speed processor 232 executing a software architecture for thecamera device 210 is used to manage data transfers with high-speedwireless circuitry 236. In certain embodiments, high-speed wirelesscircuitry 236 is configured to implement Institute of Electrical andElectronic Engineers (IEEE) 802.11 communication standards, alsoreferred to herein as Wi-Fi. In other embodiments, other high-speedcommunications standards may be implemented by high-speed wirelesscircuitry 236.

Memory 234 includes any storage device capable of storing camera datagenerated by the camera 214 and video processor 212. While memory 234 isshown as integrated with high-speed circuitry 230, in other embodiments,memory 234 may be an independent standalone element of the camera device210. In certain such embodiments, electrical routing lines may provide aconnection through a chip that includes the high-speed processor 232from the video processor 212 or low-power processor 222 to the memory234. In other embodiments, the high-speed processor 232 may manageaddressing of memory 234 such that the low-power processor 222 will bootthe high-speed processor 232 any time that a read or write operationinvolving memory 234 is needed.

In various embodiments, the lower power circuitry 220 and/or thehigh-speed circuitry 230 may consume power as part of the operation ofthe camera device 210 and in the course of performing one or morefunctions such as capturing images, transmitting data, or performingother computing processes. Such power consumption may result in heatthat may impact the camera device 210 as well as a user wearing thedevice. Embodiments described herein may function to manage temperaturein wearable devices such as glasses 31, discussed above with respect toFIG. 1 , of which the camera device 210 may be a part in some aspects.

FIGS. 3 and 4 illustrate two embodiments of glasses which includedisplay systems. In various different embodiments, such display systemsmay be integrated with the camera devices discussed above, or may beimplemented as wearable devices without an integrated camera. Inembodiments without a camera, power conservation systems and methodscontinue to operate for the display system and other such systems in amanner similar to what is described above for the video processor anddata transfer elements of the camera devices.

FIG. 3 illustrates glasses 361 having an integrated display 211. Theglasses 361 can be of any suitable type, including glasses 31, and likereference numerals have been used to describe like components of glasses361 and 31. For simplicity, only a portion of the glasses 361 are shownin FIG. 3 . Headwear or glasses 361 can optionally include left andright optical lenses 362, 563 secured within respective left and rightoptical element holders 36, 37. The glasses 361 can additionally includeany suitable left and right optical elements or assemblies 366, whichcan be similar to any of the optical elements or assemblies discussedherein including optical elements 43, 44 of glasses 31. Although onlyone optical assembly 366 is shown in FIG. 3 , it is appreciated that anoptical assembly 366 can be provided for both eyes of the user.

In one embodiment, the optical assembly 366 includes any suitabledisplay matrix 367. Such a display matrix 367 can be of any suitabletype, such as a liquid crystal display (LCD), an organic light-emittingdiode (OLED) display, or any other such display. The optical assembly366 also includes an optical layer or layers 368, which can be includelenses, optical coatings, prisms, mirrors, waveguides, and other opticalcomponents in any combination. In the embodiment illustrated in FIG. 3 ,the optical layer 368 is a prism having a suitable size andconfiguration and including a first surface 371 for receiving light fromdisplay matrix 367 and a second surface 372 for emitting light to theeye of the user. The prism extends over all or at least a portion of theoptical element holder 36, 37 so to permit the user to see the secondsurface 372 of the prism when the eye of the user is viewing through thecorresponding optical element holder 36. The first surface 371 facesupwardly from the frame 32 and the display matrix 367 overlies the prismso that photons and light emitted by the display matrix 367 impinge thefirst surface 371. The prism is sized and shaped so that the light isrefracted within the prism and is directed towards the eye of the userby the second surface 372. In this regard, the second surface 372 can beconvex so as to direct the light towards the center of the eye. Theprism can optionally be sized and shaped so as to magnify the imageprojected by the display matrix 367, and the light travels through theprism so that the image viewed from the second surface 372 is larger inone or more dimensions than the image emitted from the display matrix367.

Glasses 361 can include any suitable computing system, including any ofthe computing devices disclosed herein, such as computer 61 or machine1000. In the embodiment of FIG. 3 , computer 376 powered by a suitablerechargeable battery (not shown), which can be similar to battery 62, isprovided. Computer 376 can receive a data stream from one or more imagesensors 377, which may be similar to camera 69, or the camera 214, withimage sensors 377 positioned such that the image sensor 377 senses thesame scene as an eye of a wearer of glasses 361. Additional sensors,such as outwardly-facing geometry sensor 378, can be used for anysuitable purpose, including the scanning and capturing ofthree-dimensional geometry that may be used by computer 376 with datafrom image sensors 377 to provide information via digital display matrix367.

Computer 376 is implemented using the processor elements of the cameradevice 210, including video processor 212, high-speed circuitry 230, andlow-power circuitry 220. Computer 376 may additionally include anycircuitry needed to power and process information for display matrix367, which may be similar to display 211. In certain embodiments, videoprocessor 212 or high-speed processor 232 may include circuitry to drivedisplay matrix 367. In other embodiments, separate display circuitry maybe integrated with the other elements of computer 376 to enablepresentation of images on display matrix 367.

In various embodiments, the computer 376 may generate heat as part ofglasses operations for capturing images, transmitting data, orperforming other computing processes. The heat may impact the device aswell as a user wearing the device. Embodiments described herein mayfunction to manage temperature in wearable devices such as glasses 361.

FIG. 4 illustrates another example embodiment, shown as glasses 491,having another implementation of a display. Just as with glasses 361,glasses 491 can be of any suitable type, including glasses 31, andreference numerals have again been used to describe like components ofglasses 491 and 361. Glasses 491 include optical lenses 492 securedwithin each of the left and right optical element holders 36, 37. Thelens 492 has a front surface 493 and an opposite rear surface 494. Theleft and right end portions 41,42 of the frame front piece 33 caninclude respective left and right frame extensions 496, 497 that extendrearward from the respective end portions 41, 42. Left and right templepieces 46, 47 are provided, and can either be fixedly secured torespective frame extensions 496, 497 or removably attachable to therespective frame extensions 496, 497. In one embodiment, any suitableconnector mechanism 498 is provided for securing the temple pieces 46,47 to the respective frame extension 496, 497.

Glasses 491 includes computer 401, and just as with computer 376,computer 401 may be implemented using the processor elements of cameradevice 210, including video processor 212, high-speed circuitry 230, andlow-power circuitry 220, and computer 401 may additionally include anycircuitry needed to power and process information for the integrateddisplay elements.

Sensors 402 include one or more cameras, which may be similar to camera214 and/or other digital sensors that face outward, away from the user.The data feeds from these sensors 402 go to computer 401. In theembodiment of FIG. 4 the computer 401 is disposed within the firstportion 51 of right temple piece 47, although the computer 401 could bedisposed elsewhere in alternative embodiments. In the embodiment of FIG.4 , right temple piece 47 includes removable cover section 403 foraccess to computer 401 or other electronic components of glasses 491.

Glasses 491 include optical elements or assemblies 405, which may besimilar to any other optical elements or assemblies described herein.One optical assembly 405 is shown, but in other embodiments, opticalassemblies may be provided for both eyes of a user. Optical assembly 405includes laser projector 407, which is a three-color laser projectorusing a scanning mirror or galvanometer. During operation, an opticalsource such as a laser projector is disposed in one of the arms ortemples of the glasses, and is shown in right temple piece 47 of glasses491. The computer 401 connects to the laser projector 407. The opticalassembly 605 includes one or more optical strips 411. The optical strips411 are spaced apart across the width of lens 492, as illustrated bylens 492 in right optical element holder 37 of FIG. 4 . In otherembodiments, the optical strips 411 may be spaced apart across a depthof the lens 492 between the front surface 493 and the rear surface 494of lens 492 as shown in the partial view of lens 492 in the top cornerof FIG. 4 .

During operation, computer 401 sends data to laser projector 407. Aplurality of light paths 412 are depicted, showing the paths ofrespective photons emitted by the laser projector 407. The path arrowsillustrate how lenses or other optical elements direct the photons onpaths 412 that take the photons from the laser projector 407 to the lens492. As the photons then travel across the lens 492, the photonsencounter a series of optical strips 411. When a particular photonencounters a particular optical strip 411, it is either redirectedtowards the user's eye, or it passes to the next optical strip 411.Specific photons or beams of light may be controlled by a combination ofmodulation of laser projector 407 and modulation of optical strips 411.Optical strips 411 may, in certain embodiments, be controlled throughmechanical, acoustic, or electromagnetic signals initiated by computer401.

In one example implementation of the optical strips 411, each strip 411can use Polymer Dispersed Liquid Crystal to be opaque or transparent ata given instant of time, per software command from computer 401. In adifferent example implementation of the optical strips 411, each opticalstrip 411 can have a specific wavelength of light that it redirectstoward the user, passing all the other wavelengths through to the nextoptical strip 411. In a different example implementation of the opticalstrips 411, each strip 411 can have certain regions of the strip 411that cause redirection with other regions passing light, and the laserprojector 407 can use high precision steering of the light beams totarget the photons at the desired region of the particular intendedoptical strip 411.

In the embodiment of lens 492 illustrated in the top left of FIG. 4 ,optical strips 411 are disposed in and spaced apart along the width of afirst layer 416 of the lens 492, which is secured in a suitable mannerto a second layer 417 of the lens 492. In one embodiment, the frontsurface 493 is formed by the second layer 417 and the rear surface 494is formed by the first layer 416. The second layer 417 can be providedwith reflective coatings on at least a portion of the surfaces thereofso that the laser light bounces off such surfaces so as to travel alongthe layer 417 until the light encounters a strip 411 provided in thefirst layer 416, and is either redirected towards the eye of the user orcontinues on to the next strip 411 in the manner discussed above.

In various embodiments, the computer 401 may consume power as part ofglasses 491 operations for capturing images, transmitting data, orperforming other computing processes. Such power consumption may resultin heat that may impact the glasses 491 as well as a user wearing thedevice. Embodiments described herein may function to manage temperaturein wearable devices such as glasses 491.

FIG. 5 is a flowchart of a method for regulating a temperature of anelectronic component. In some aspects, the electronic componentregulated by the process 300 discussed below with respect to FIG. 5 maybe the low power circuitry 220 and/or high-speed circuitry 230,discussed above with respect to FIG. 2 . In some aspects, the low powercircuitry 220 and/or high-speed circuitry 230 may be integrated into theglasses 361 of FIG. 3 or glasses 491 of FIG. 4 . In some aspects, one ormore functions of process 500 discussed below may be performed by thetemperature management application 967, discussed below with respect toFIG. 9 . For example, in some aspects, instructions 1016, discussedbelow with respect to FIG. 10 , may configure one or more hardwareprocessors, such as hardware processor s 1010 discussed below withrespect to FIG. 10 , to perform one or more of the functions of process500 discussed below. In some other embodiments, one or more of thefunctions of process 500 discussed below may be performed by thecomputer 61, the camera device 210, or the computers 376 and/or 401 ofFIGS. 1-4 respectively.

Process 500 ensures the temperature of the regulated component stayswithin an acceptable range. The acceptable range may be defined by oneor more of an operating range specified by the component manufacturer,and a range that provides for human comfort when operating a deviceincluding the component. For example, in some aspects, the camera device210 may be integrated into a wearable component, such that temperaturesof the electronic components of the camera device 210, (e.g. thelow-power circuitry 220 and/or the high-speed circuitry 230) may betransferred to the human operator. Thus, it may be desirable to regulatethe temperature of these components to not only stay within theoperating ranges specified by their respective manufacturers, but alsoto provide for human comfort of the wearable device when operating. Thetemperatures may be regulated by controlling an amount of datatransmitted by the electronic component during a period of time. In someaspects, a heat generated by an electronic component may be a functionof an amount of data the component transmits during a period of time.The more data transmitted, the more heat generated in some aspects.Thus, heat generation may be proportional to data transmission rate insome aspects. Thus, to control temperature, process 500 may place alimit on an amount of data generated by the regulated electroniccomponent within a period of time. If the temperature of the componentis well below certain threshold, the transmission of data may beunlimited, or a relatively high limit may be placed on the datatransmitted during a time period. If the temperature of the component isabove particular thresholds, or relatively close to a maximumtemperature, transmission of data may be limited during the time period.For example, limiting transmission may include, for example, preventingthe transmission of data that is otherwise available for transmissionbased on a current temperature of the component. More details onmanaging temperature of the electronic component is discussed below. Forpurposes of discussion, as process 500 may iterate in variousembodiments, an operative transmission rate limit of the electroniccomponent when block 501 is entered may be referred to as a firsttransmission rate limit.

At block 501, a temperature of a component is determined. The componentmay be the low power circuity 220 or the high speed circuitry 230discussed above with respect to FIG. 2 in some aspects. The temperaturemay be determined in some aspects, by reading a temperature value fromthe component itself. For example, some components may have built intemperature sensors, and can provide the temperature of the component.In other aspects, some devices may include a separate temperature sensorpositioned proximate to the component, such that a reading of thetemperature sensor correlates with a temperature of the component.Process 500 may then rely on the separate temperature sensor in theseaspects. Block 501 may also include determination of a rate oftemperature change. For example, block 501 may store a previous n numberof temperature values, and compute a rate of change based on the storevalues. This determined rate may be used by one or more of the decisionblocks discussed below and shown in FIG. 5 to determine whether toincrease or decrease a transmission rate limit of the component.

Decision block 502 determines whether a component temperature is withina first predetermined temperature range. In some aspects, the componentmay be the low power circuitry 220 and/or the high-speed circuitry 230,discussed above with respect to FIG. 2 . In some aspects, the firstpredetermined temperature range may be a range of 20 degrees Celsius.For example, in some aspects, the range may be between 0° C. and 20° C.

If the temperature of the component is within the first predeterminedrange, process 500 moves from decision block 502 to decision block 504,which evaluates whether a rate of temperature change of the component isbelow a first predetermined rate. In some aspects, temperatures of thecomponent may be recorded periodically, for example, once every one (1)second, two (2) seconds, three (3) seconds, four (4) seconds, five (5)seconds, ten (10) seconds, fifteen (15) seconds, thirty (30) seconds, orsixty (60) seconds. A rate of temperature change over a time period maythen be determined as described above with respect to block 501. In someaspects, the rate is determined based on two or more temperaturerecordings of the component. The rate may be determined based on arolling time period. For example, the rate may be determined based ontemperature readings made during the last one minute, two minutes, threeminutes, four minutes, five minutes or any time period.

If the rate of temperature change is below a first predeterminedthreshold rate, process 500 moves to block 506, and a transmission ratelimit of bandwidth/throughput of the component is increased from a firstlimit to a second limit. In some aspects, the first predeterminedthreshold rate may be 15° C./min. In some aspects, this may result inthe component transmitting data at a transmission rate above the firstlimit. In some aspects, block 506 increases the transmission rate limitby 2 Mbit/sec. In some aspects, an amount the transmission rate isincreased may be based on a difference between a maximum wearabletemperature and a current wearable temperature. For example, block 506may incorporate one or more of the functions discussed below withrespect to FIG. 8 . In some aspects, the adjustment may be based on anambient temperature, as also discussed below.

If the rate of temperature change is not below the first predeterminedthreshold rate, process 500 moves to block 508, and the transmissionrate limit is decreased from the first limit to a third limit. In someaspects, block 508 decreases the transmission rate limit by 2 Mbit/sec.In some aspects, an amount the transmission rate is decreased in block508 may be based on a difference between a maximum wearable temperatureand a current wearable temperature. For example, block 508 mayincorporate one or more of the functions discussed below with respect toFIG. 8 . In some aspects, the adjustment may be based on an ambienttemperature, as also discussed below. After adjusting the transmissionrate limit in blocks 506 or 508, process 500 moves to block 507.

After either of blocks 506 or 508 is performed, process 500 moves toblock 507. Block 507 may wait for a period of time. In some aspects, thewait in block 507 may provide a specific periodicity to the temperaturecontrol loop implemented by process 500. For example, in some aspects,wait block 507 may induce a periodicity between iterations of the waitblock 507, thus indirectly causing process 500 as a whole to iterate atthe periodicity.

After block 507 completes its wait, process 500 returns to block 501.

Returning to the discussion of decision block 502, if the componenttemperature evaluated in block 502 is not within the first temperaturerange, process 500 moves from decision block 502 to decision block 510.Decision block 510 evaluates whether the temperature of the component iswithin a second predetermined temperature range. In some aspects, thesecond temperature range may be broader than the first temperaturerange. In some aspects, the second temperature range may include ahigher set of temperatures than the first temperature range. In someaspects, the first and second temperature ranges do not overlap, but areadjoining, in that there are no temperature measurements that may fallbetween the first range and the second range.

In some aspects, the second temperature range may be 28 degrees Celsiuswide. For example, in some aspects, the second temperature range may bebetween 21° C. and 49° C. If the component temperature determined inblock 501 is within the second range, process 500 moves to decisionblock 512, which determines whether the rate of temperature change isbelow a second predetermined rate.

As discussed above with respect to decision block 501, temperatures ofthe component may be recorded periodically, for example, once every one(1) second, two (2) seconds, three (3) seconds, four (4) seconds, five(5) seconds, ten (10) seconds, fifteen (15) seconds, thirty (30)seconds, or sixty (60) seconds. The rate of temperature change over atime period may then be determined. In some aspects, the rate isdetermined based on two or more temperature recordings of the component.The rate may be determined based on a rolling time period. For example,the rate may be determined based on temperature readings made during thelast one minute, two minutes, three minutes, four minutes, five minutesor any time period.

In some aspects, the second predetermined rate may be lower than thefirst rate of block 504. For example, in some aspects of process 500, afirst rate of temperature rise may be tolerated when the temperature ofthe component is with a first range, whereas a second rate, lower thanthe first rate, may be tolerated when the temperature of the componentis within a second range higher than the first range.

If the rate of temperature change is below the second rate, process 500moves from decision block 512 to block 514, where the transmission ratelimit is increased from the first transmission rate limit to a fourthtransmission rate limit. In some aspects, the limit is increased by 2Mbit/sec in block 514. In some aspects, an amount the transmission rateis increased may be based on a difference between a maximum wearabletemperature and a current wearable temperature. For example, block 514may incorporate one or more of the functions discussed below withrespect to FIG. 8 . In some aspects, the adjustment may be based on anambient temperature, as also discussed below.

Otherwise, if the rate of temperature change is not below the secondrate in block 512, process 500 moves to block 516, which decreases thetransmission rate limit from the first transmission rate limit to afifth transmission rate limit. In some aspects, the first limit may bereduced by 2 Mbit/sec in block 516. In some aspects, an amount thetransmission rate is increased may be based on a difference between amaximum wearable temperature and a current wearable temperature. Forexample, block 516 may incorporate one or more of the functionsdiscussed below with respect to FIG. 8 . In some aspects, the adjustmentmay be based on an ambient temperature, as also discussed below.

Returning to the discussion of decision block 510, if the componenttemperature is not within the second predetermined range, process 500moves to decision block 520, which determines if the componenttemperature is within a third predetermined temperature range. In someaspects, the third temperature range is between 50° C. and 80° C. Insome aspects, the third temperature range is any temperature over apredetermined temperature value, such as 50° C. If the componenttemperature is within the third temperature range, then process 500moves to decision block 522, which determines if the rate determined inblock 501 is below a third predetermined threshold rate. In someaspects, the third predetermined threshold rate may be 5° C./minute. Ifthe rate is below the third rate, process 500 moves to block 524, wherethe transmission rate limit of the component is increased. In someaspects, the transmission rate limit may be increased by 2 Mbit/sec.

Returning to the discussion of decision block 520, if the determinedtemperature is not within the third temperature range, processingcontinues below.

In some aspects, the second and fourth transmission rate limits may beequivalent, and the third and fifth transmission rate limits may beequivalent. In other aspects, these limits may be different. Forexample, multiple iterations of process 500 may cause these limits todiverge.

Some aspects of process 500 may also include maximum temperature limitsfor the component. In these aspects, if the temperature of the componentexceeds the maximum temperature limit, the component may be shutdown. Inother words, the transmission rate limit may be set to zero in someaspects. For example, in some aspects, the low power circuitry 220 maybe shut down if its temperature exceeds 63° C. In some aspects, thehigh-speed circuitry 230 may be shut down if its temperature exceeds 73°C.

Some aspects of process 500 also include limiting an amount of datatransmitted during a time period to an amount indicated by thetransmission rate limit. For example, in some aspects, a moving count ofdata transmitted during a sequential series of time periods may bemaintained. These moving counts can facilitate determination of datatransmission rates over those same time periods. If the moving countindicates that the device has reached the transmission rate limit asdefined by process 500 above, then delays may be introduced intotransmission of additional data. For example, if an amount of dataavailable for transmission would cause the device to exceed thetransmission rate limit for a given time period, that data may waituntil a later time such that a rate of transmission that includes thedata does not exceed the transmission rate limit.

Some aspects of process 500 may deviate from the transmission ratelimits discussed above. For example, in some aspects, process 500 mayconsider a prospective completion time of a current transmission whendetermining whether to decrease a transmission rate in block 508 and/or516. For example, if a current transmission will complete within atimeframe such that a temperature of the wireless component will notexceed certain operational parameters, the transmission rate may not bedecreased. Upon completion of the current transmission, the temperaturerate may be reevaluated, for example, upon initiating of a nexttransmission. For example, the current transmission may includetransmission of a file. The file may be an image file, a video file, orany type of file. The file may represent a discrete set of data, suchthat an end time for the transmission can be determined. For example, anend time may be determined based on an amount of data of the file thatremains unacknowledged by a remote device to which the file is beingtransmitted, and a current transmission rate of data to the remotedevice. From this information, a completion time may be determined.

Based on the completion time and a current time, a remaining time may bedetermined. Furthermore, based on a remaining time, a current rate oftemperature change, and a current temperature, a temperature at thecompletion time may be determined, for example, via Equation (1) below:completion temperature=ct+tr*(rt)  (1)

where:

-   -   ct=current temperature    -   tr=time remaining    -   rt=rate of temperature change

In some aspects, if the completion temperature is less than anoperational limit threshold, then a decrease of the transmission ratelimit, such as described above with respect to blocks 508 and/or 516,may be deferred until at least the completion time.

FIG. 6 is a graph illustrating an exemplary relationship between ambienttemperature and a maximum comfortable temperature for a wearable device.The graph 600 shows that when ambient temperatures are relatively cool,such as at ambient temperature 605 a, a relatively higher wearabledevice temperature 605 b may be considered comfortable. For example, ona cold winter's day, a user of a wearable device may in some aspects,take comfort in a wearable device that is relatively warm. In contrast,on a hot day, such as that reflected by ambient temperature 610 a, auser may find a device operating at that same temperature as intolerablywarm. Instead, a lower temperature 610 b may be considered comfortable.Some aspects of the disclosed methods and systems may consider ambienttemperature when determining a maximum frame temperature, and may adjusta maximum transmission rate of the disclosed transmission circuitry tomaintain frame temperature at a temperature comfortable for the ambientconditions.

FIG. 7 shows another exemplary embodiment of glasses 361. The embodimentof glasses 361 shown in FIG. 7 includes the components of glasses 361shown in FIG. 3 . In this embodiment, the glasses 361 also include anambient temperature sensor 705 and a frame temperature sensor 710. Theambient temperature sensor 705 and frame temperature sensor 710 may beincluded in the peripheral device elements 219, discussed above withrespect to FIG. 2 . In some aspects, the ambient temperature sensor 705and frame temperature sensor 710 may be operably connected to thecomputer 376, such that the computer may obtain temperature measurementsof the ambient environment and the frame from the ambient temperaturesensor 705 and frame temperature sensor 710 respectively.

FIG. 8 is a flowchart of an exemplary method of managing temperature ofa wearable device. In some aspects, process 800 discussed below withrespect to FIG. 8 may operate in conjunction with process 500, discussedabove with respect to FIG. 5 . In some aspects, one or more of thefunctions discussed below with respect to FIG. 8 may be performed by thecomputer 376, discussed above with respect to FIG. 3 and FIG. 7 .

Process 800 may utilize a lookup table that represents a relationshipbetween an ambient temperature and a maximum frame temperature, forexample, as shown above with respect to graph 600. In other aspects,process 800 may utilize an equation to generate a maximum frametemperature based on an ambient temperature. For example, an exemplaryequation is Equation 2, shown below:Max temperature=K−Ambient temperature  (2)

where:

-   -   K is a constant value.

Block 810 determines an ambient temperature. In some aspects, theambient temperature may be determined via readings from an ambienttemperature sensor, such as the sensor 705 discussed above.

In block 820, a maximum wearable temperature is determined based on theambient temperature. In some aspects, the maximum wearable temperaturemay be determined based on Equation 2 above, and utilizing the ambienttemperature determined in block 810. In some other aspects, a mappingtable may be utilized to determine the maximum wearable temperaturebased on the ambient temperature. For example, a mapping table mayprovide maximum ambient temperatures for a set of ambient temperatures.An example of such a mapping is provided in graph 600, discussed abovewith respect to FIG. 6 .

In block 830, a wearable temperature is determined. In some aspects, thewearable temperature is determined based on readings from a temperaturesensor, such as temperature sensor 710, discussed above with respect toFIG. 7 .

In block 840, a difference between the maximum wearable temperaturedetermined in block 820 and the determined wearable temperature in block830 is obtained.

In block 850, a transmission rate limit is adjusted based on thedifference. In some aspects, if the difference is less than a threshold,the transmission rate limit may be reduced. If the difference is notless than the threshold, the transmission rate may be maintained. Insome aspects, if the difference is greater than a second threshold, thetransmission rate limit may be increased, but not to exceed a maximumvalue.

While the methods described above present operations in a particularorder, it will be appreciated that alternate embodiments may operatewith certain operations occurring simultaneously or in a differentorder. In many such embodiments, the order and timing of operations mayvary between instances of the operation, with the exact timing managedby a low-power processor such as the low-power processor 222 operatingto reduce power usage, and to return the device to a low-power state asquickly as possible.

Certain embodiments are described herein as including logic or a numberof components, modules, elements, or mechanisms. Such modules canconstitute either software modules (e.g., code embodied on amachine-readable medium or in a transmission signal) or hardwaremodules. A “hardware module” is a tangible unit capable of performingcertain operations and can be configured or arranged in a certainphysical manner. In various example embodiments, one or more computersystems (e.g., a standalone computer system, a client computer system,or a server computer system) or one or more hardware modules of acomputer system (e.g., a processor or a group of processors) isconfigured by software (e.g., an application or application portion) asa hardware module that operates to perform certain operations asdescribed herein.

In some embodiments, a hardware module is implemented mechanically,electronically, or any suitable combination thereof. For example, ahardware module can include dedicated circuitry or logic that ispermanently configured to perform certain operations. For example, ahardware module can be a special-purpose processor, such as aField-Programmable Gate Array (FPGA) or an Application SpecificIntegrated Circuit (ASIC). A hardware module may also includeprogrammable logic or circuitry that is temporarily configured bysoftware to perform certain operations. For example, a hardware modulecan include software encompassed within a general-purpose processor orother programmable processor. It will be appreciated that the decisionto implement a hardware module mechanically, in dedicated andpermanently configured circuitry, or in temporarily configured circuitry(e.g., configured by software) can be driven by cost and timeconsiderations.

Accordingly, the phrase “hardware module” should be understood toencompass a tangible entity, be that an entity that is physicallyconstructed, permanently configured (e.g., hardwired), or temporarilyconfigured (e.g., programmed) to operate in a certain manner or toperform certain operations described herein. As used herein,“hardware-implemented module” refers to a hardware module. Consideringembodiments in which hardware modules are temporarily configured (e.g.,programmed), each of the hardware modules need not be configured orinstantiated at any one instance in time. For example, where a hardwaremodule comprises a general-purpose processor configured by software tobecome a special-purpose processor, the general-purpose processor may beconfigured as respectively different special-purpose processors (e.g.,comprising different hardware modules) at different times. Software canaccordingly configure a particular processor or processors, for example,to constitute a particular hardware module at one instance of time andto constitute a different hardware module at a different instance oftime.

Hardware modules can provide information to, and receive informationfrom, other hardware modules. Accordingly, the described hardwaremodules can be regarded as being communicatively coupled. Where multiplehardware modules exist contemporaneously, communications can be achievedthrough signal transmission (e.g., over appropriate circuits and buses)between or among two or more of the hardware modules. In embodiments inwhich multiple hardware modules are configured or instantiated atdifferent times, communications between such hardware modules may beachieved, for example, through the storage and retrieval of informationin memory structures to which the multiple hardware modules have access.For example, one hardware module performs an operation and stores theoutput of that operation in a memory device to which it iscommunicatively coupled. A further hardware module can then, at a latertime, access the memory device to retrieve and process the storedoutput. Hardware modules can also initiate communications with input oroutput devices, and can operate on a resource (e.g., a collection ofinformation).

The various operations of example methods described herein can beperformed, at least partially, by one or more processors that aretemporarily configured (e.g., by software) or permanently configured toperform the relevant operations. Whether temporarily or permanentlyconfigured, such processors constitute processor-implemented modulesthat operate to perform one or more operations or functions describedherein. As used herein, “processor-implemented module” refers to ahardware module implemented using one or more processors.

Similarly, the methods described herein can be at least partiallyprocessor-implemented, with a particular processor or processors beingan example of hardware. For example, at least some of the operations ofa method can be performed by one or more processors orprocessor-implemented modules. Moreover, the one or more processors mayalso operate to support performance of the relevant operations in a“cloud computing” environment or as a “software as a service” (SaaS).For example, at least some of the operations may be performed by a groupof computers (as examples of machines including processors), with theseoperations being accessible via a network (e.g., the Internet) and viaone or more appropriate interfaces (e.g., an Application ProgramInterface (API)).

The performance of certain of the operations may be distributed amongthe processors, not only residing within a single machine, but deployedacross a number of machines. In some example embodiments, the processorsor processor-implemented modules are located in a single geographiclocation (e.g., within a home environment, an office environment, or aserver farm). In other example embodiments, the processors orprocessor-implemented modules are distributed across a number ofgeographic locations.

FIG. 9 is a block diagram 900 illustrating an architecture of software902, which can be installed on any one or more of the devices describedabove. FIG. 9 is merely a non-limiting example of a softwarearchitecture, and it will be appreciated that many other architecturescan be implemented to facilitate the functionality described herein. Invarious embodiments, the software 902 is implemented by hardware such ascomputer 61, camera device 210, computer 376, and/or computer 401 ofFIGS. 1, 2, 3, and 4 respectively. In some aspects, the software 902 maybe executed by a machine 1000 of FIG. 10 , discussed below. The software902 may include a stack of layers where each layer may provide aparticular functionality. For example, the software 902 may include oneor more layers such as an operating system 904, libraries 906,frameworks 908, and applications 910. Operationally, the applications910 invoke application programming interface (API) calls 912 through thesoftware stack and receive messages 914 in response to the API calls912, consistent with some embodiments. In various embodiments, anyclient device 290, server computer of a server system 298, or any otherdevice described herein may operate using elements of software 902.Devices such as the camera device 210 may additionally be implementedusing aspects of software 902, with the architecture adapted foroperating using low-power circuitry (e.g., low-power circuitry 220) andhigh-speed circuitry (e.g., high-speed circuitry 230) as describedherein.

In various implementations, the operating system 904 manages hardwareresources and provides common services. The operating system 904includes, for example, a kernel 920, services 922, and drivers 924. Thekernel 920 acts as an abstraction layer between the hardware and theother software layers consistent with some embodiments. For example, thekernel 920 provides memory management, processor management (e.g.,scheduling), component management, networking, and security settings,among other functionality. The services 922 can provide other commonservices for the other software layers. The drivers 924 are responsiblefor controlling or interfacing with the underlying hardware, accordingto some embodiments. For instance, the drivers 924 can include displaydrivers, camera drivers, BLUETOOTH® or BLUETOOTH® Low Energy drivers,flash memory drivers, serial communication drivers (e.g., UniversalSerial Bus (USB) drivers), WI-FI® drivers, audio drivers, powermanagement drivers, and so forth. In certain implementations of a devicesuch as the camera device 210, low-power circuitry may operate usingdrivers 924 that only contain BLUETOOTH® Low Energy drivers and basiclogic for managing communications and controlling other devices, withother drivers operating with high-speed circuitry.

In some embodiments, the libraries 906 provide a low-level commoninfrastructure utilized by the applications 910. The libraries 906 caninclude system libraries 930 (e.g., C standard library) that can providefunctions such as memory allocation functions, string manipulationfunctions, mathematic functions, and the like. In addition, thelibraries 906 can include API libraries 932 such as media libraries(e.g., libraries to support presentation and manipulation of variousmedia formats such as Moving Picture Experts Group-4 (MPEG4), AdvancedVideo Coding (H.264 or AVC), Moving Picture Experts Group Layer-3 (MP3),Advanced Audio Coding (AAC), Adaptive Multi-Rate (AMR) audio codec,Joint Photographic Experts Group (JPEG or JPG), or Portable NetworkGraphics (PNG)), graphics libraries (e.g., an OpenGL framework used torender in two dimensions (2D) and three dimensions (3D) in a graphiccontent on a display), database libraries (e.g., SQLite to providevarious relational database functions), web libraries (e.g., WebKit toprovide web browsing functionality), and the like. The libraries 906 canalso include a wide variety of other libraries 934 to provide many otherAPIs to the applications 910.

The frameworks 908 provide a high-level common infrastructure that canbe utilized by the applications 910, according to some embodiments. Forexample, the frameworks 908 provide various graphic user interface (GUI)functions, high-level resource management, high-level location services,and so forth. The frameworks 908 can provide a broad spectrum of otherAPIs that can be utilized by the applications 910, some of which may bespecific to a particular operating system or platform.

In an example embodiment, the applications 910 may include a homeapplication 950, a contacts application 952, a browser application 954,a location application 958, a media application 960, a messagingapplication 962, and a broad assortment of other applications such as athird party application 966. According to some embodiments, theapplications 910 are programs that execute functions defined in theprograms. Various programming languages can be employed to create one ormore of the applications 910, structured in a variety of manners, suchas object-oriented programming languages (e.g., Objective-C, Java, orC++) or procedural programming languages (e.g., C or assembly language).In a specific example, the third party application 966 (e.g., anapplication developed using the ANDROID™ or IOS™ software developmentkit (SDK) by an entity other than the vendor of the particular platform)may be mobile software running on a mobile operating system such asIOS™, ANDROID™, WINDOWS® Phone, or another mobile operating systems. Inthis example, the third party application 966 can invoke the API calls912 provided by the operating system 904 to facilitate functionalitydescribed herein.

Embodiments described herein may particularly interact with atemperature management application 967. Such an application 967 mayinteract with communication component 1064, discussed below with respectto FIG. 10 , to manage transmission bandwidth to ensure operatingtemperature of a wearable device remains within certain ranges, asdiscussed above, for example, with respect to FIG. 5 . As discussedabove, operation of electronic components may generate heat. Theelectronic components may also have an operating temperature range.Temperatures outside the range may cause faulty operation of theelectronic components. Additionally, with respect to wearable devices,operating temperatures of electronic components may affect a comfortlevel of a user of the wearable device. The temperature managementapplication 967 may function to manage temperature of one or moreelectronic components to ensure both operating ranges of the electronicdevices and comfort ranges of users of wearable devices are maintained.

FIG. 10 illustrates an example mobile device 1000 executing a mobileoperating system (e.g., IOS™, ANDROID™, WINDOWS® Phone, or other mobileoperating systems), consistent with some embodiments. In one embodiment,the mobile device 1000 includes a touch screen operable to receivetactile data from a user.

Many varieties of applications (also referred to as “apps”) can beexecuting on the mobile device 1000, such as native applications (e.g.,applications programmed in Objective-C, Swift, or another suitablelanguage running on IOS™, or applications programmed in Java running onANDROID™), mobile web applications (e.g., applications written inHypertext Markup Language-5 (HTML5)), or hybrid applications (e.g., anative shell application that launches an HTML5 session). For example,the mobile device 1000 includes a messaging app, an audio recording app,a camera app, a book reader app, a media app, a fitness app, a filemanagement app, a location app, a browser app, a settings app, acontacts app, a telephone call app, or other apps (e.g., gaming apps,social networking apps, biometric monitoring apps). In another example,the mobile device 1000 includes a social messaging app such as SNAPCHAT®that, consistent with some embodiments, allows users to exchangeephemeral messages that include media content. In this example, thesocial messaging app can incorporate aspects of embodiments describedherein.

Such a social messaging application may integrate the functionality ofthe temperature management application 967 to manage temperature ofelectronic components included in the device 1000.

FIG. 10 shows a diagrammatic representation of a machine 1000 in theexample form of a computer system, within which instructions 1016 (e.g.,software, a program, an application, an applet, an app, or otherexecutable code) for causing the machine 1000 to perform any one or moreof the methodologies discussed herein can be executed. In alternativeembodiments, the machine 1000 operates as a standalone device or can becoupled (e.g., networked) to other machines. In a networked deployment,the machine 1000 may operate in the capacity of a server machine or aclient machine in a server-client network environment, or as a peermachine in a peer-to-peer (or distributed) network environment. Themachine 1000 can comprise, but not be limited to, a server computer, aclient computer, a personal computer (PC), a tablet computer, a laptopcomputer, a netbook, a set-top box (STB), a personal digital assistant(PDA), an entertainment media system, a cellular telephone, a smartphone, a mobile device, a wearable device (e.g., a smart watch), a smarthome device (e.g., a smart appliance), other smart devices, a webappliance, a network router, a network switch, a network bridge, or anymachine capable of executing the instructions 1016, sequentially orotherwise, that specify actions to be taken by the machine 1000.Further, while only a single machine 1000 is illustrated, the term“machine” shall also be taken to include a collection of machines 1000that individually or jointly execute the instructions 1016 to performany one or more of the methodologies discussed herein.

In various embodiments, the machine 1000 comprises processors 1010,memory 1030, and I/O components 1050, which can be configured tocommunicate with each other via a bus 1002. In an example embodiment,the processors 1010 (e.g., a Central Processing Unit (CPU), a ReducedInstruction Set Computing (RISC) processor, a Complex Instruction SetComputing (CISC) processor, a Graphics Processing Unit (GPU), a DigitalSignal Processor (DSP), an Application Specific Integrated Circuit(ASIC), a Radio-Frequency Integrated Circuit (RFIC), another processor,or any suitable combination thereof) include, for example, a processor1012 and a processor 1014 that may execute the instructions 1016. Theterm “processor” is intended to include multi-core processors that maycomprise two or more independent processors (also referred to as“cores”) that can execute instructions contemporaneously. Although FIG.10 shows multiple processors 1010, the machine 1000 may include a singleprocessor with a single core, a single processor with multiple cores(e.g., a multi-core processor), multiple processors with a single core,multiple processors with multiples cores, or any combination thereof.

The memory 1030 comprises a main memory 1032, a static memory 1034, anda storage unit 1036 accessible to the processors 1010 via the bus 1002,according to some embodiments. The storage unit 1036 can include amachine-readable medium 1038 on which are stored the instructions 1016embodying any one or more of the methodologies or functions describedherein. The instructions 1016 can also reside, completely or at leastpartially, within the main memory 1032, within the static memory 1034,within at least one of the processors 1010 (e.g., within the processor'scache memory), or any suitable combination thereof, during executionthereof by the machine 1000. Accordingly, in various embodiments, themain memory 1032, the static memory 1034, and the processors 1010 areconsidered machine-readable media 1038.

As used herein, the term “memory” refers to a machine-readable medium1038 able to store data temporarily or permanently and may be taken toinclude, but not be limited to, random-access memory (RAM), read-onlymemory (ROM), buffer memory, flash memory, and cache memory. While themachine-readable medium 1038 is shown in an example embodiment to be asingle medium, the term “machine-readable medium” should be taken toinclude a single medium or multiple media (e.g., a centralized ordistributed database, or associated caches and servers) able to storethe instructions 1016. The term “machine-readable medium” shall also betaken to include any medium, or combination of multiple media, that iscapable of storing instructions (e.g., instructions 1016) for executionby a machine (e.g., machine 1000), such that the instructions, whenexecuted by one or more processors of the machine 1000 (e.g., processors1010), cause the machine 1000 to perform any one or more of themethodologies described herein. Accordingly, a “machine-readable medium”refers to a single storage apparatus or device, as well as “cloud-based”storage systems or storage networks that include multiple storageapparatus or devices. The term “machine-readable medium” shallaccordingly be taken to include, but not be limited to, one or more datarepositories in the form of a solid-state memory (e.g., flash memory),an optical medium, a magnetic medium, other non-volatile memory (e.g.,Erasable Programmable Read-Only Memory (EPROM)), or any suitablecombination thereof. The term “machine-readable medium” specificallyexcludes non-statutory signals per se.

The I/O components 1050 include a wide variety of components to receiveinput, provide output, produce output, transmit information, exchangeinformation, capture measurements, and so on. In general, it will beappreciated that the I/O components 1050 can include many othercomponents that are not shown in FIG. 10 . The I/O components 1050 aregrouped according to functionality merely for simplifying the followingdiscussion, and the grouping is in no way limiting. In various exampleembodiments, the I/O components 1050 include output components 1052 andinput components 1054. The output components 1052 include visualcomponents (e.g., a display such as a plasma display panel (PDP), alight emitting diode (LED) display, a liquid crystal display (LCD), aprojector, or a cathode ray tube (CRT)), acoustic components (e.g.,speakers), haptic components (e.g., a vibratory motor), other signalgenerators, and so forth. The input components 1054 include alphanumericinput components (e.g., a keyboard, a touch screen configured to receivealphanumeric input, a photo-optical keyboard, or other alphanumericinput components), point-based input components (e.g., a mouse, atouchpad, a trackball, a joystick, a motion sensor, or other pointinginstruments), tactile input components (e.g., a physical button, a touchscreen that provides location and force of touches or touch gestures, orother tactile input components), audio input components (e.g., amicrophone), and the like.

In some further example embodiments, the I/O components 1050 includebiometric components 1056, motion components 1058, environmentalcomponents 1060, or position components 1062, among a wide array ofother components. For example, the biometric components 1056 includecomponents to detect expressions (e.g., hand expressions, facialexpressions, vocal expressions, body gestures, or eye tracking), measurebiosignals (e.g., blood pressure, heart rate, body temperature,perspiration, or brain waves), identify a person (e.g., voiceidentification, retinal identification, facial identification,fingerprint identification, or electroencephalogram basedidentification), and the like. The motion components 1058 includeacceleration sensor components (e.g., accelerometer), gravitation sensorcomponents, rotation sensor components (e.g., gyroscope), and so forth.The environmental components 1060 include, for example, illuminationsensor components (e.g., photometer), temperature sensor components(e.g., one or more thermometers that detect ambient temperature),humidity sensor components, pressure sensor components (e.g.,barometer), acoustic sensor components (e.g., one or more microphonesthat detect background noise), proximity sensor components (e.g.,infrared sensors that detect nearby objects), gas sensor components(e.g., machine olfaction detection sensors, gas detection sensors todetect concentrations of hazardous gases for safety or to measurepollutants in the atmosphere), or other components that may provideindications, measurements, or signals corresponding to a surroundingphysical environment. The environmental components, such as thetemperature sensor components that detect ambient temperature, may beutilized to manage the temperature of electronic components discussedherein.

The position components 1062 include location sensor components (e.g., aGlobal Positioning System (GPS) receiver component), altitude sensorcomponents (e.g., altimeters or barometers that detect air pressure fromwhich altitude may be derived), orientation sensor components (e.g.,magnetometers), and the like.

Communication can be implemented using a wide variety of technologies.The I/O components 1050 may include communication components 1064operable to couple the machine 1000 to a network 1080 or devices 1070via a coupling 1082 and a coupling 1072, respectively. For example, thecommunication components 1064 include a network interface component oranother suitable device to interface with the network 1080. In furtherexamples, communication components 1064 include wired communicationcomponents, wireless communication components, cellular communicationcomponents, Near Field Communication (NFC) components, BLUETOOTH®components (e.g., BLUETOOTH® Low Energy), WI-FI® components, and othercommunication components to provide communication via other modalities.The devices 1070 may be another machine or any of a wide variety ofperipheral devices (e.g., a peripheral device coupled via a UniversalSerial Bus (USB)). As discussed above, in some aspects, the disclosedmethods and systems may manage the transmission bandwidth of one or moreof the wireless components (e.g. WiFi) and/or Bluetooth components inorder to control an operating temperature of a device, such as thedevice 1000. In some aspects, the communication components 1064 includedthe low power circuitry 220 and/or high speed circuitry 230.

In some embodiments, the communication components 1064 detectidentifiers or include components operable to detect identifiers. Forexample, the communication components 1064 include Radio FrequencyIdentification (RFID) tag reader components, NFC smart tag detectioncomponents, optical reader components (e.g., an optical sensor to detecta one-dimensional bar codes such as a Universal Product Code (UPC) barcode, multi-dimensional bar codes such as a Quick Response (QR) code,Aztec Code, Data Matrix, Dataglyph, MaxiCode, PDF417, Ultra Code,Uniform Commercial Code Reduced Space Symbology (UCC RSS)-2D bar codes,and other optical codes), acoustic detection components (e.g.,microphones to identify tagged audio signals), or any suitablecombination thereof. In addition, a variety of information can bederived via the communication components 1064, such as location viaInternet Protocol (IP) geo-location, location via WI-FI® signaltriangulation, location via detecting an BLUETOOTH® or NFC beacon signalthat may indicate a particular location, and so forth.

Transmission Medium

In various example embodiments, one or more portions of the network 1080can be an ad hoc network, an intranet, an extranet, a virtual privatenetwork (VPN), a local area network (LAN), a wireless LAN (WLAN), a widearea network (WAN), a wireless WAN (WWAN), a metropolitan area network(MAN), the Internet, a portion of the Internet, a portion of the PublicSwitched Telephone Network (PSTN), a plain old telephone service (POTS)network, a cellular telephone network, a wireless network, a WI-FI®network, another type of network, or a combination of two or more suchnetworks. For example, the network 1080 or a portion of the network 1080may include a wireless or cellular network, and the coupling 1082 may bea Code Division Multiple Access (CDMA) connection, a Global System forMobile communications (GSM) connection, or another type of cellular orwireless coupling. In this example, the coupling 1082 can implement anyof a variety of types of data transfer technology, such as SingleCarrier Radio Transmission Technology (1×RTT), Evolution-Data Optimized(EVDO) technology, General Packet Radio Service (GPRS) technology,Enhanced Data rates for GSM Evolution (EDGE) technology, thirdGeneration Partnership Project (3GPP) including 3G, fourth generationwireless (4G) networks, Universal Mobile Telecommunications System(UMTS), High Speed Packet Access (HSPA), Worldwide Interoperability forMicrowave Access (WiMAX), Long Term Evolution (LTE) standard, othersdefined by various standard-setting organizations, other long rangeprotocols, or other data transfer technology.

In example embodiments, the instructions 1016 are transmitted orreceived over the network 1080 using a transmission medium via a networkinterface device (e.g., a network interface component included in thecommunication components 1064) and utilizing any one of a number ofwell-known transfer protocols (e.g., Hypertext Transfer Protocol(HTTP)). Similarly, in other example embodiments, the instructions 1016are transmitted or received using a transmission medium via the coupling1072 (e.g., a peer-to-peer coupling) to the devices 1070. The term“transmission medium” shall be taken to include any intangible mediumthat is capable of storing, encoding, or carrying the instructions 1016for execution by the machine 1000, and includes digital or analogcommunications signals or other intangible media to facilitatecommunication of such software.

Furthermore, the machine-readable medium 1038 is non-transitory (inother words, not having any transitory signals) in that it does notembody a propagating signal. However, labeling the machine-readablemedium 1038 “non-transitory” should not be construed to mean that themedium is incapable of movement; the medium 1038 should be considered asbeing transportable from one physical location to another. Additionally,since the machine-readable medium 1038 is tangible, the medium 1038 maybe considered to be a machine-readable device.

Language

Throughout this specification, plural instances may implementcomponents, operations, or structures described as a single instance.Although individual operations of one or more methods are illustratedand described as separate operations, one or more of the individualoperations may be performed concurrently, and nothing requires that theoperations be performed in the order illustrated. Structures andfunctionality presented as separate components in example configurationsmay be implemented as a combined structure or component. Similarly,structures and functionality presented as a single component may beimplemented as separate components. These and other variations,modifications, additions, and improvements fall within the scope of thesubject matter herein.

Although an overview of the inventive subject matter has been describedwith reference to specific example embodiments, various modificationsand changes may be made to these embodiments without departing from thebroader scope of embodiments of the present disclosure. Such embodimentsof the inventive subject matter may be referred to herein, individuallyor collectively, by the term “invention” merely for convenience andwithout intending to voluntarily limit the scope of this application toany single disclosure or inventive concept if more than one is, in fact,disclosed.

The embodiments illustrated herein are described in sufficient detail toenable those skilled in the art to practice the teachings disclosed.Other embodiments may be used and derived therefrom, such thatstructural and logical substitutions and changes may be made withoutdeparting from the scope of this disclosure. The Detailed Description,therefore, is not to be taken in a limiting sense, and the scope ofvarious embodiments is defined only by the appended claims, along withthe full range of equivalents to which such claims are entitled.

As used herein, the term “or” may be construed in either an inclusive orexclusive sense. Moreover, plural instances may be provided forresources, operations, or structures described herein as a singleinstance. Additionally, boundaries between various resources,operations, modules, engines, and data stores are somewhat arbitrary,and particular operations are illustrated in a context of specificillustrative configurations. Other allocations of functionality areenvisioned and may fall within a scope of various embodiments of thepresent disclosure. In general, structures and functionality presentedas separate resources in the example configurations may be implementedas a combined structure or resource. Similarly, structures andfunctionality presented as a single resource may be implemented asseparate resources. These and other variations, modifications,additions, and improvements fall within a scope of embodiments of thepresent disclosure as represented by the appended claims. Thespecification and drawings are, accordingly, to be regarded in anillustrative rather than a restrictive sense.

What is claimed is:
 1. A device comprising: a memory storinginstructions that when executed by at least one processor, configuresthe at least one processor to perform operations comprising: computingan amount of time for exchanging data; computing a completiontemperature based on the amount of time for exchanging the data and agiven temperature of the device; and performing a transmission ratefunction in response to computing the completion temperature.
 2. Thedevice of claim 1, wherein the device is a wearable electronic device,the transmission rate function being associated with exchange of thedata.
 3. The device of claim 1, wherein the operations further compriseperforming the computing of the completion temperature in response todetermining that a transmission rate of the device should be decreased.4. The device of claim 1, wherein the operations comprise determining acurrent rate of temperature change, wherein the transmission ratefunction comprises decreasing a transmission rate of the device.
 5. Thedevice of claim 1, wherein the given temperature is a currenttemperature, wherein the device comprises glasses that comprise a frame,and the device further comprises a frame temperature sensor configuredto measure a temperature of the frame, and wherein the temperature ofthe device is determined based on the frame temperature sensor.
 6. Thedevice of claim 1, wherein the operations further comprise: transmittingthe data to a remote device from the device; determining an amount ofdata that remains unacknowledged by the remote device to which the datais being transmitted; and determining a current transmission rate of thedevice based on the amount of data that remains unacknowledged by theremote device.
 7. The device of claim 1, wherein the operations furthercomprise: computing a remaining time for transmission of the data bydividing an amount of data that remains unacknowledged by a remotedevice by a current transmission rate; and computing the completiontemperature by adding a current temperature of the device to theremaining time multiplied by a rate of temperature change.
 8. The deviceof claim 1, further comprising a wireless transmitter temperaturesensor, the operations further comprising reading data from the wirelesstransmitter temperature sensor, and determining given temperature of thedevice based on the data read from the wireless transmitter temperaturesensor.
 9. The device of claim 1, the operations further comprising:comparing a current rate of temperature change to a first rate thresholdor a second rate threshold in response to a current temperature of thedevice falling within a first temperature range or a second temperaturerange, respectively; and adjusting a transmission rate limit in responseto comparing the current rate of temperature change to the first ratethreshold or the second rate threshold.
 10. The device of claim 9,wherein the operations further comprise adjusting the transmission ratelimit of the device by delaying transmissions to avoid exceeding theadjusted transmission rate limit.
 11. The device of claim 1, wherein theoperations further comprise: determining whether the given temperatureof the device is within a first temperature range or a second adjacenttemperature range; and adjusting a transmission rate limit based ondetermining that the given temperature of the device is in the firsttemperature range or the second adjacent temperature range.
 12. Thedevice of claim 1, wherein the operations further comprise increasing atransmission rate limit in response to a current rate of temperaturechange exceeding a first or second rate threshold or decreasing thetransmission rate limit in response to the current rate of temperaturechange of the device not exceeding the first or second rate threshold.13. The device of claim 12, wherein the first rate threshold is 15degrees Celsius per minute, and the second rate threshold is 10 degreesCelsius per minute.
 14. The device of claim 1, wherein the operationsfurther comprise increasing or decreasing a transmission rate limit by 2Mbit/sec.
 15. A method comprising: computing, by one or more processors,an amount of time for exchanging data; computing a completiontemperature based on the amount of time for exchanging the data and agiven temperature of a device; and performing a transmission ratefunction in response to computing the completion temperature.
 16. Themethod of claim 15, wherein the device is a wearable electronic device,the transmission rate function being associated with exchange of thedata.
 17. The method of claim 15, further comprising performing thecomputing of the completion temperature in response to determining thata transmission rate of the device should be decreased.
 18. The method ofclaim 15, further comprising determining a current rate of temperaturechange, and wherein the transmission rate function comprises decreasinga transmission rate of the device.
 19. The method of claim 15, whereinthe given temperature is a current temperature, wherein the devicecomprises glasses that comprise a frame, and the device furthercomprises a frame temperature sensor configured to measure a temperatureof the frame, and wherein the given temperature of the device isdetermined based on the frame temperature sensor.
 20. A non-transitorycomputer-readable storage medium comprising instructions that, whenexecuted, configure hardware processing circuitry to perform operationscomprising: computing an amount of time for exchanging data; computing acompletion temperature based on the amount of time for exchanging thedata and a given temperature of a device; and performing a transmissionrate function in response to computing the completion temperature.